CV

Education

Apr. 2022 – Sep. 2026
Ph.D. of Information Science

School of Information Science and Technology, the University of Osaka, Japan

Supervisor: Professor Yasuyuki Matsushita

Apr. 2020 – Mar. 2022
Master of Information Science

School of Information Science and Technology, the University of Osaka, Japan

Apr. 2016 – Mar. 2020
Bachelor of Engineering

School of Engineering, the University of Osaka, Japan

Work Experience

Oct. 2026 – Sep. 2027 (expected)
Visiting Scholar

Columbia University, New York, USA

Host: Professor Shree Nayar

Jun. 2025 – Sep. 2026
Research Intern

Microsoft Research Asia, Tokyo, Japan

Embodied AI

Jun. 2024 – Aug. 2024
International Visiting Research Trainee

York University, Canada

Host: Professor Michael S. Brown

Camera spectral sensitivity estimation

Oct. 2021 – Jun. 2025
Research Assistant

the University of Osaka, Japan

Apr. 2021 – Sep. 2021
Part-time Research Assistant

Mitsubishi Electric Corp. and the University of Osaka, Japan

CT image super-resolution via deep learning

Apr. 2020 – Nov. 2020
Part-time Research Assistant

RICOH Industrial Solutions Inc. and the University of Osaka, Japan

3D reconstruction of oil paintings by photometric-stereo

Aug. 2020 – Sep. 2020
Research Internship

R&D Center Sony Group Corporation, Japan

Analysis of multi-attribute point cloud data for efficient compression

Skills

  • Programming Languages: Python
  • Software: Blender, Docker, Git, LaTeX
  • Languages: English (fluent), Japanese (native)

Awards

Mar. 2022
Best Master Thesis Award

Graduate School of Information Science and Technology, the University of Osaka

Apr. 2022
Science Award for Female Graduate Students

the University of Osaka

May 2026
Outstanding Reviewer

IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) 2026

Academic Service

  • Conference Reviewer: CVPR, NeurIPS, ACCV

Research Funding

Apr. 2023 – Mar. 2025
Support for Pioneering Research Initiated by the Next Generation (SPRING)

Japan Science and Technology Agency (JST)

Title: High-fidelity 3D shape and material reconstruction

Total grant: 1.2 million Yen (≈ US$ 8,400)